Invention Grant
- Patent Title: Thin film structure with controlled lateral thermal spreading in the thin film
- Patent Title (中): 薄膜结构在薄膜中具有受控的横向热扩散
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Application No.: US11707280Application Date: 2007-02-16
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Publication No.: US07869162B2Publication Date: 2011-01-11
- Inventor: Bin Lu , Ganping Ju , Julius K. Hohlfeld , Duane C. Karns , Amit V. Itagi , William A. Challener , Hua Zhou
- Applicant: Bin Lu , Ganping Ju , Julius K. Hohlfeld , Duane C. Karns , Amit V. Itagi , William A. Challener , Hua Zhou
- Applicant Address: US CA Scotts Valley
- Assignee: Seagate Technology LLC
- Current Assignee: Seagate Technology LLC
- Current Assignee Address: US CA Scotts Valley
- Agency: Pietragallo Gordon Alfano Bosick & Raspanti, LLP
- Agent Benjamin T. Queen, II
- Main IPC: G11B5/33
- IPC: G11B5/33
Abstract:
An apparatus includes a magnetic layer, a heat sink layer, and a thermal resistor layer between the magnetic layer and the heat sink layer. The apparatus may be configured as a thin film structure arranged for data storage. The apparatus may also include an interlayer positioned between the magnetic layer and the thermal resistor layer.
Public/Granted literature
- US20080198738A1 Thin film structure with controlled lateral thermal spreading in the thin film Public/Granted day:2008-08-21
Information query
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