发明授权
- 专利标题： Method for packaging light-emitting diode
- 专利标题（中）： 封装发光二极管的方法
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申请号： US12418552申请日： 2009-04-03
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公开(公告)号： US07871835B2公开(公告)日： 2011-01-18
- 发明人: Shu-Ling Yeh , Ya-Lan Chuang , Pei-Jung Tsai , Chih-Hsiang Lin , Hsin-Ching Kao , Feng-Chih Chang , Tang-Jung Wu
- 申请人： Shu-Ling Yeh , Ya-Lan Chuang , Pei-Jung Tsai , Chih-Hsiang Lin , Hsin-Ching Kao , Feng-Chih Chang , Tang-Jung Wu
- 申请人地址： TW TW
- 专利权人： Industrial Technology Research Institute,Topco Technologies Corp.
- 当前专利权人： Industrial Technology Research Institute,Topco Technologies Corp.
- 当前专利权人地址： TW TW
- 代理机构： Lowe Hauptman Ham & Berner, LLP
- 优先权： TW97132383A 20080825
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L21/469 ; H01L21/31
摘要：
Disclosed is a method for packaging an LED by a thermoplastic copolymer. The copolymer is polymerized by 100 parts by weight of an acrylic ester, 0.1 to 30 parts by weight of a hydrogen bond monomer, and 0.1 to 70 parts by weight of a bulky monomer. The copolymer has transparency greater than 90%, thermal resistance greater than 130° C., and moisture absorption less than 0.5 wt %, such that the copolymer may be applied as packaging material for a light emitting device.
公开/授权文献
- US20100047936A1 METHOD FOR PACKAGING LIGHT-EMITTING DIODE 公开/授权日：2010-02-25
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