发明授权
- 专利标题： Method of semiconductor packaging
- 专利标题（中）： 半导体封装方法
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申请号： US12620321申请日： 2009-11-17
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公开(公告)号： US07871860B1公开(公告)日： 2011-01-18
- 发明人: Han-Ping Pu , Tsung-Shu Lin , Chen-Shien Chen
- 申请人： Han-Ping Pu , Tsung-Shu Lin , Chen-Shien Chen
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Haynes and Boone, LLP
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L21/50 ; H01L21/48 ; H01L21/44 ; H01L21/46
摘要：
The present disclosure provides a method of fabricating a semiconductor device. The method includes providing a chip and a substrate. The method also includes bonding the chip to the substrate. The method also includes, after the bonding the chip, dispensing a sealing material between the chip and the substrate. In accordance with the method, the chip and the substrate are maintained within a temperature range from the bonding the chip to the dispensing the sealing material, and wherein a lower limit of the temperature range is approximately twice a room temperature.
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