发明授权
- 专利标题: Circuit substrate and method
- 专利标题(中): 电路基板及方法
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申请号: US10532119申请日: 2003-10-27
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公开(公告)号: US07872237B2公开(公告)日: 2011-01-18
- 发明人: Kimmo Puhakka , Iain Benson
- 申请人: Kimmo Puhakka , Iain Benson
- 申请人地址: CY Limassol
- 专利权人: IPL Intellectual Property Licensing Limited
- 当前专利权人: IPL Intellectual Property Licensing Limited
- 当前专利权人地址: CY Limassol
- 代理机构: Knobbe Martens Olson & Bear LLP
- 优先权: GB0224902.7 20021025; GB0224903.5 20021025
- 国际申请: PCT/GB03/04635 WO 20031027
- 国际公布: WO2004/038810 WO 20040506
- 主分类号: G01T1/24
- IPC分类号: G01T1/24 ; H01L21/00
摘要:
Embodiments of the invention are concerned with semiconductor circuit substrates for use in a radiation detection device, said radiation detection device comprising a detector substrate having a plurality of detector cells arranged to generate charge in response to incident radiation, each of said detector cells including at least one detector cell contact for coupling charge from said detector cell to said semiconductor circuit substrate. More particularly, in embodiments of the invention the semiconductor circuit substrate comprises: a plurality of cell circuit contacts, each of which is configured to receive charge from a corresponding detector cell contact, cell circuitry associated with said plurality of cell circuit contacts; one or more conductive pathways arranged to carry at least one of control, readout and power supply signals to and/or from said cell circuitry; and one or more signal pathways extending through said semiconductor circuit substrate, said one or more signal pathways being electrically coupled to said conductive pathways so as to provide an external signal interface for said cell circuitry. Embodiments in accordance with the present invention thus provide a means of routing signals through the semiconductor circuit substrate to an electrical contact on a surface of the semiconductor circuit substrate. The electrical contact on the surface of the circuit substrate can then be directly coupled to a corresponding electrical contact on a mount.
公开/授权文献
- US20080093560A1 Circuit Substrate and Method 公开/授权日:2008-04-24
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