发明授权
- 专利标题： Mounting board, height adjusting apparatus and mounting method
- 专利标题（中）： 安装板，高度调节装置和安装方法
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申请号： US11867277申请日： 2007-10-04
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公开(公告)号： US07872875B2公开(公告)日： 2011-01-18
- 发明人: Tsuyoshi So , Yoshinori Uzuka , Osamu Aizawa , Hideo Kubo
- 申请人： Tsuyoshi So , Yoshinori Uzuka , Osamu Aizawa , Hideo Kubo
- 申请人地址： JP Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JP Kawasaki
- 代理机构： Westerman, Hattori, Daniels & Adrian, LLP
- 优先权： JP2006-352747 20061227
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
An electronic part having mounting terminals made of a thermally-meltable bonding material is mounted on a mounting board. A structural part is used for moving a height-adjusting member to a position under the electronic part in a process of heating and melting the thermally-meltable bonding material so as to maintain a predetermined distance between the electronic part and the mounting board.
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