发明授权
- 专利标题: Method and apparatus for joining adhesive tape
- 专利标题(中): 连接胶带的方法和装置
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申请号: US12569625申请日: 2009-09-29
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公开(公告)号: US07875145B2公开(公告)日: 2011-01-25
- 发明人: Masayuki Yamamoto , Naoki Ishii
- 申请人: Masayuki Yamamoto , Naoki Ishii
- 申请人地址: JP Osaka
- 专利权人: Nitto Denko Corporation
- 当前专利权人: Nitto Denko Corporation
- 当前专利权人地址: JP Osaka
- 代理机构: Cheng Law Group, PLLC
- 优先权: JP2008-253865 20080930
- 主分类号: B32B37/10
- IPC分类号: B32B37/10
摘要:
An adhesive tape is supplied to a back face side of a ring frame, joined to the ring frame with a joining roller, and cut by pivoting a cutter blade along the ring frame. Subsequently, an inspection ring of an inspecting mechanism perform suction on the adhesive tape while contacting the adhesive tape adjacent an inner periphery of the ring frame. Separation of the adhesive tape from the ring frame is determined based on variations of the suction pressure. When the separation of the adhesive tape from the ring frame is detected, the adhesive tape is joined again with the joining roller provided in the cutter mechanism.
公开/授权文献
- US20100078114A1 METHOD AND APPARATUS FOR JOINING ADHESIVE TAPE 公开/授权日:2010-04-01
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