发明授权
US07875496B2 Flip chip mounting method, flip chip mounting apparatus and flip chip mounting body
有权
倒装芯片安装方法，倒装芯片安装装置和倒装芯片安装体
- 专利标题： Flip chip mounting method, flip chip mounting apparatus and flip chip mounting body
- 专利标题（中）： 倒装芯片安装方法，倒装芯片安装装置和倒装芯片安装体
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申请号： US11914416申请日： 2006-03-30
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公开(公告)号： US07875496B2公开(公告)日： 2011-01-25
- 发明人: Seiichi Nakatani , Seiji Karashima , Takashi Kitae , Yoshihisa Yamashita , Takashi Ichiryu
- 申请人： Seiichi Nakatani , Seiji Karashima , Takashi Kitae , Yoshihisa Yamashita , Takashi Ichiryu
- 申请人地址： JP Osaka
- 专利权人： Panasonic Corporation
- 当前专利权人： Panasonic Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： Hamre, Schumann, Mueller & Larson, P.C.
- 优先权： JP2005-143744 20050517
- 国际申请： PCT/JP2006/306688 WO 20060330
- 国际公布： WO2006/123478 WO 20061123
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A flip chip mounting method includes holding a circuit board (213) and a semiconductor chip (206), aligning the circuit board (213) with the semiconductor chip (206) while holding them with a predetermined gap therebetween, heating the circuit board (213) or the semiconductor chip (206) to a temperature at which solder powder in a solder resin composition (216) formed of solder powder (214) and a resin (215) is melted, supplying the solder resin composition (216) by a capillary phenomenon, and curing the resin (215), wherein the melted solder powder (214) in the solder resin composition (216) is moved through the predetermined gap across which the circuit board (213) and the semiconductor chip (206) are held, and self-assembled and grown, whereby the connection terminals (211) and the electrode terminals (207) are connected to each other electrically. According to this configuration, a flip chip mounting method having high productivity and reliability, which enables a next generation semiconductor chip to be mounted on a circuit board, a mounted body thereof, and a mounting apparatus thereof are provided.