Invention Grant
- Patent Title: Embedded capacitor device having a common coupling area
- Patent Title (中): 具有公共耦合区域的嵌入式电容器装置
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Application No.: US11531337Application Date: 2006-09-13
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Publication No.: US07875808B2Publication Date: 2011-01-25
- Inventor: Huey-Ru Chang , Min-Lin Lee , Shinn-Juh Lay , Chin Sun Shyu
- Applicant: Huey-Ru Chang , Min-Lin Lee , Shinn-Juh Lay , Chin Sun Shyu
- Applicant Address: TW Chutung, Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Chutung, Hsinchu
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
- Main IPC: H05K1/16
- IPC: H05K1/16

Abstract:
An embedded capacitor device within a circuit board having an integrated circuitry thereon is provided. The circuit board has a common coupling area under the integrated circuitry. The embedded capacitor device includes a first capacitor section providing at least one capacitor to a first terminal set of the integrated circuitry and a second capacitor section providing at least one capacitor to a second terminal set of the integrated circuitry. A portion of the first capacitor section is in the common coupling area and has its coupling to the first terminal set located in the common coupling area. Similarly, a portion of the second capacitor section is in the common coupling area and has its coupling to the second terminal set located in the common coupling area.
Public/Granted literature
- US20070062726A1 EMBEDDED CAPACITOR DEVICE HAVING A COMMON COUPLING AREA Public/Granted day:2007-03-22
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