发明授权
US07875967B2 Integrated circuit with step molded inner stacking module package in package system
有权
集成电路与步进式内置堆叠模块封装在封装系统中
- 专利标题： Integrated circuit with step molded inner stacking module package in package system
- 专利标题（中）： 集成电路与步进式内置堆叠模块封装在封装系统中
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申请号： US12045646申请日： 2008-03-10
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公开(公告)号： US07875967B2公开(公告)日： 2011-01-25
- 发明人: DeokKyung Yang , In Sang Yoon , Jae Han Chung
- 申请人： DeokKyung Yang , In Sang Yoon , Jae Han Chung
- 申请人地址： SG Singapore
- 专利权人： Stats Chippac Ltd.
- 当前专利权人： Stats Chippac Ltd.
- 当前专利权人地址： SG Singapore
- 代理商 Mikio Ishimaru
- 主分类号： H01L23/02
- IPC分类号： H01L23/02 ; H01L29/40 ; H01L23/28
摘要：
An integrated circuit package system including: providing a substrate; mounting an integrated circuit above the substrate; mounting an inner stacking module, having an inner stacking module encapsulation and a molded integral step molded in the inner stacking module encapsulation, above the integrated circuit; and encapsulating the inner stacking module, and the integrated circuit with an encapsulation.