发明授权
- 专利标题： Substrate and manufacturing method of the same, and semiconductor device and manufacturing method of the same
- 专利标题（中）： 基板及其制造方法相同，半导体器件及其制造方法相同
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申请号： US12168518申请日： 2008-07-07
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公开(公告)号： US07875988B2公开(公告)日： 2011-01-25
- 发明人: Masanobu Shoji , Toru Fujita
- 申请人： Masanobu Shoji , Toru Fujita
- 申请人地址： JP Tokyo
- 专利权人： Seiko Epson Corporation
- 当前专利权人： Seiko Epson Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Oliff & Berridge PLC
- 优先权： JP2007-199565 20070731
- 主分类号： H01L23/58
- IPC分类号： H01L23/58 ; H01L23/544
摘要：
A substrate for fixing an integrated circuit element includes: a plurality of metal columns that are aligned in a longitudinal direction and a lateral direction in a planar view, each of the plurality of metal columns having a first face and a second face facing opposite direction to the first face; and a connecting part that connects the plurality of metal columns one another at a part of each of the plurality of metal columns between the first face and the second face. In the substrate, a recognition mark is formed on the first face of one of the plurality of metal columns.
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