The camera module comprises: an insulating substrate 13 having an imaging device 18 on a front face thereof and a plurality of solder balls 21 on a rear face thereof; a cylindrical lens holder 14 securely fixed on the substrate 13, composed of an upper large-diameter portion 14-1 and a lower small-diameter portion 14-2 and having a lens 15 therein; a cylindrical shield 12 fitted onto the small-diameter portion 14-2 of the lens holder and composed of a cylindrical side portion 12-2 fixed on the large-diameter portion 14-1 of the lens holder and a plate-shaped bottom portion 12-1 in contact with the rear face of the insulating substrate 13 and having an opening 12-1a for conduction; and a mounting board 11 connected with the insulating substrate 13 by the plurality of solder balls 21 formed on the rear face of the insulating substrate 13.