发明授权
- 专利标题： Light emitting chip apparatuses with a thermally superconducting heat transfer medium for thermal management
- 专利标题（中）： 具有用于热管理的热超导传热介质的发光芯片装置
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申请号： US10887601申请日： 2004-07-09
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公开(公告)号： US07878232B2公开(公告)日： 2011-02-01
- 发明人: Mehmet Arik , Stanton Earl Weaver, Jr.
- 申请人： Mehmet Arik , Stanton Earl Weaver, Jr.
- 申请人地址： US OH Cleveland
- 专利权人： GE Lighting Solutions, LLC
- 当前专利权人： GE Lighting Solutions, LLC
- 当前专利权人地址： US OH Cleveland
- 代理机构： Fay Sharpe LLP
- 主分类号： F28F7/00
- IPC分类号： F28F7/00 ; F28D15/00 ; F21V29/00
摘要：
A light emitting apparatus (10, 110, 210, 310, 410) includes one or more light emitting chips (12, 112, 212, 312, 412) and a support (13, 14, 114, 214, 314, 414) on which the light emitting chips are disposed. The support includes a first side on which the light emitting chips are attached and a second side opposite the first side. A thermally superconducting heat transfer medium (22, 122, 222, 322, 422) is disposed in an interior volume of the support and thermally connects the first and second sides of the support. The thermally superconducting heat transfer medium has a thermal conductivity at least 1500 times greater than the thermal conductivity of copper.
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