Invention Grant
- Patent Title: Multilayer substrate and method of manufacturing the same
- Patent Title (中): 多层基板及其制造方法
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Application No.: US12659712Application Date: 2010-03-18
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Publication No.: US07879656B2Publication Date: 2011-02-01
- Inventor: Hiroki Kamiya , Motoki Shimizu , Satoshi Takeuchi
- Applicant: Hiroki Kamiya , Motoki Shimizu , Satoshi Takeuchi
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JP2006-329856 20061206
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48
Abstract:
A multilayer substrate includes an insulating base member having a plurality of resin films, an electric element embedded in the insulating base member, and a spacer. The resin films are made of a thermoplastic resin and stacked and attached to each other. At least one resin film has a through hole for inserting the electric element. The one resin film further has a plurality of protruding members. One protruding member opposes to another one protruding member so that the one and the another one contact and sandwich the electric element. The spacer is arranged between the one resin film and an adjacent resin film and is disposed at a base portion of one of the protruding members.
Public/Granted literature
- US20100175250A1 Multilayer substrate and method of manufacturing the same Public/Granted day:2010-07-15
Information query
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