发明授权
- 专利标题: Semiconductor device and method for manufacturing the same
- 专利标题(中): 半导体装置及其制造方法
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申请号: US12040224申请日: 2008-02-29
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公开(公告)号: US07879658B2公开(公告)日: 2011-02-01
- 发明人: Yoshio Ozawa , Ichiro Mizushima , Takashi Suzuki , Hirokazu Ishida , Yoshitaka Tsunashima
- 申请人: Yoshio Ozawa , Ichiro Mizushima , Takashi Suzuki , Hirokazu Ishida , Yoshitaka Tsunashima
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- 优先权: JP2007-051792 20070301
- 主分类号: H01L21/00
- IPC分类号: H01L21/00 ; H01L29/04
摘要:
A semiconductor device includes a silicon crystal layer on an insulating layer, the silicon crystal layer containing a crystal lattice mismatch plane, a memory cell array portion on the silicon crystal layer, the memory cell array portion including memory strings, each of the memory strings including nonvolatile memory cell transistors connected in series in a first direction, the memory strings being arranged in a second direction orthogonal to the first direction, the crystal lattice mismatch plane crossing the silicon crystal along the second direction without passing under gates of the nonvolatile memory cell transistors as viewed from a top of the silicon crystal layer, or crossing the silicon crystal along the first direction with passing under gates of the nonvolatile memory cell transistors as viewed from the top of the silicon crystal layer.
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