发明授权
- 专利标题： Printing of redistribution traces on electronic component
- 专利标题（中）： 在电子元件上印刷再分布痕迹
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申请号： US12264751申请日： 2008-11-04
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公开(公告)号： US07880489B2公开(公告)日： 2011-02-01
- 发明人: Benjamin N. Eldridge , Yoshikazu Hatsukano , Igor Y. Khandros , Gaetan L. Mathieu
- 申请人： Benjamin N. Eldridge , Yoshikazu Hatsukano , Igor Y. Khandros , Gaetan L. Mathieu
- 申请人地址： US CA Livermore
- 专利权人： FormFactor, Inc.
- 当前专利权人： FormFactor, Inc.
- 当前专利权人地址： US CA Livermore
- 代理机构： Kirton & McConkie
- 主分类号： G01R31/02
- IPC分类号： G01R31/02
摘要：
A probe substrate for use in testing semiconductor devices can include a base substrate that can have first electrical terminals at a first pitch. One or more redistribution layers on the base substrate can include droplets of a conductive material that form redistribution traces extending from the first terminals to second electrical terminals at a second pitch different from the first pitch.
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