发明授权
- 专利标题: Socket assembly with pick up cap
- 专利标题(中): 插座装配带上盖
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申请号: US12386604申请日: 2009-04-20
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公开(公告)号: US07883345B2公开(公告)日: 2011-02-08
- 发明人: Cheng-Chi Yeh , Chia-Wei Fan
- 申请人: Cheng-Chi Yeh , Chia-Wei Fan
- 申请人地址: TW Taipei Hsien
- 专利权人: Hon Hai Precision Ind. Co., Ltd.
- 当前专利权人: Hon Hai Precision Ind. Co., Ltd.
- 当前专利权人地址: TW Taipei Hsien
- 代理商 Andrew C. Cheng; Wei Te Chung; Ming Chieh Chang
- 优先权: TW97213403A 20080729
- 主分类号: H01R13/44
- IPC分类号: H01R13/44
摘要:
A socket assembly comprises a socket and a pick up cap attached on the socket. The socket has an insulative housing with sidewalls, and the sidewalls have a plurality of protrusions extending upwardly and formed with end surfaces. The pick up cap comprises a plurality of cutouts with inner side surfaces. The inner side surface of the cutout abuts against corresponding end surface of insulative housing to position the pick up cap on the insulative housing. An interference force created between the cutout and the protrusion extends along an extending direction of corresponding sidewall.
公开/授权文献
- US20100029107A1 Socket assembly with pick up cap 公开/授权日:2010-02-04
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