This invention provides a transparent electrically conductive film, which, while maintaining the light transparency of a transparent film, has excellent electrical conductivity, can be utilized for electromagnetic wave shielding, and does not cause inclusion of air bubbles in the lamination onto other base material, and a process for producing the same. The production process comprises the steps of forming a large number of concaves and convexes having an average height of not more than 0.1 μm on both sides or one side of a transparent film, forming a resist layer having a pattern shape opposite to the electrically conductive part in the electrically conductive film on the transparent film on its concave-convex side, applying a catalyst for plating onto the resist layer-formed face, separating the resist layer, forming a metal layer by plating, and blackening the metal layer, the metal layer satisfying 1≦W/T≦500 wherein W represents the width of the metal layer and T represents the height of the metal layer.