Invention Grant
- Patent Title: Semiconductor device having a fin structure and method of manufacturing the same
- Patent Title (中): 具有翅片结构的半导体器件及其制造方法
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Application No.: US12219984Application Date: 2008-07-31
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Publication No.: US07883972B2Publication Date: 2011-02-08
- Inventor: Jae-Man Yoon , Choong-Ho Lee , Chul Lee , Dong-Gun Park
- Applicant: Jae-Man Yoon , Choong-Ho Lee , Chul Lee , Dong-Gun Park
- Applicant Address: KR Gyeonngi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonngi-do
- Agency: Harness, Dickey & Pierce, PLC
- Priority: KR2004-60069 20040730
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A semiconductor device may include a fin structure having source/drain regions and channel fins connected between source/drain patterns. A gate insulation layer may be provided on the channel fins. A gate electrode may include lower gate patterns and an upper gate pattern. The lower gate patterns may extend in a vertical direction and contact the gate insulation layer. The upper gate pattern may extend in a second horizontal direction substantially perpendicular to the first horizontal direction. The upper gate pattern may be connected to upper portions of the lower gate patterns.
Public/Granted literature
- US20080293203A1 Semiconductor device having a fin structure and method of manufacturing the same Public/Granted day:2008-11-27
Information query
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