发明授权
- 专利标题: Method and system for non-destructive distribution profiling of an element in a film
- 专利标题(中): 电影中元素的非破坏性分布分布的方法和系统
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申请号: US12220645申请日: 2008-07-25
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公开(公告)号: US07884321B2公开(公告)日: 2011-02-08
- 发明人: Paola deCecco , Bruno Schueler , David Reed , Michael Kwan , David Stephen Ballance
- 申请人: Paola deCecco , Bruno Schueler , David Reed , Michael Kwan , David Stephen Ballance
- 申请人地址: US CA Sunnyvale
- 专利权人: Revera, Incorporated
- 当前专利权人: Revera, Incorporated
- 当前专利权人地址: US CA Sunnyvale
- 代理机构: Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号: H01J37/26
- IPC分类号: H01J37/26
摘要:
A method to determine a distribution profile of an element in a film. The method comprises exciting an electron energy of an element deposited in a first film, obtaining a first spectrum associating with the electron energy, and removing a background spectrum from the first spectrum. Removing the background value generates a processed spectrum. The method further includes matching the processed spectrum to a simulated spectrum with a known simulated distribution profile for the element in a film comparable to the first film. A distribution profile is obtained for the element in the first film based on the matching of the processed spectrum to a simulated spectrum selected from the set of simulated spectra.
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