Invention Grant
- Patent Title: Method and system for non-destructive distribution profiling of an element in a film
- Patent Title (中): 电影中元素的非破坏性分布分布的方法和系统
-
Application No.: US12220645Application Date: 2008-07-25
-
Publication No.: US07884321B2Publication Date: 2011-02-08
- Inventor: Paola deCecco , Bruno Schueler , David Reed , Michael Kwan , David Stephen Ballance
- Applicant: Paola deCecco , Bruno Schueler , David Reed , Michael Kwan , David Stephen Ballance
- Applicant Address: US CA Sunnyvale
- Assignee: Revera, Incorporated
- Current Assignee: Revera, Incorporated
- Current Assignee Address: US CA Sunnyvale
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01J37/26
- IPC: H01J37/26

Abstract:
A method to determine a distribution profile of an element in a film. The method comprises exciting an electron energy of an element deposited in a first film, obtaining a first spectrum associating with the electron energy, and removing a background spectrum from the first spectrum. Removing the background value generates a processed spectrum. The method further includes matching the processed spectrum to a simulated spectrum with a known simulated distribution profile for the element in a film comparable to the first film. A distribution profile is obtained for the element in the first film based on the matching of the processed spectrum to a simulated spectrum selected from the set of simulated spectra.
Public/Granted literature
- US20080283743A1 Method and system for non-destructive distribution profiling of an element in a film Public/Granted day:2008-11-20
Information query