Invention Grant
- Patent Title: Electronic component, and method for manufacturing the same
- Patent Title (中): 电子部件及其制造方法
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Application No.: US10554699Application Date: 2004-04-30
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Publication No.: US07884698B2Publication Date: 2011-02-08
- Inventor: Hideki Tanaka , Tomoyuki Washizaki , Kiyoshi Ikeuchi , Toshiyuki Iwao , Yasuki Nagatomo , Kesato Iiboshi , Jiro Ota , Yasuhiro Izumi
- Applicant: Hideki Tanaka , Tomoyuki Washizaki , Kiyoshi Ikeuchi , Toshiyuki Iwao , Yasuki Nagatomo , Kesato Iiboshi , Jiro Ota , Yasuhiro Izumi
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2003-130091 20030508
- International Application: PCT/JP2004/006276 WO 20040430
- International Announcement: WO2004/100187 WO 20041118
- Main IPC: H01H85/04
- IPC: H01H85/04 ; H01H85/12 ; H01H69/02
Abstract:
An electronic component is provided in which: impact-absorbing layers are provided so as to cover at least the corner portions of both end portions of a base which is made of an insulating mixture of ceramic and glass; a conductive film is formed so as to cover the surface of these impact-absorbing layers and the surface of the base; the portions of this conductive film which cover the surfaces of the impact-absorbing layers are formed into electrodes; and a resistance-adjusting groove is provided in an other portion of the conductive film than the portions serving as the electrodes.
Public/Granted literature
- US20060255897A1 Electronic component, and method for manufacturing the same Public/Granted day:2006-11-16
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