Invention Grant
- Patent Title: Flexible electronic assembly
- Patent Title (中): 灵活的电子组装
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Application No.: US11536691Application Date: 2006-09-29
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Publication No.: US07885079B2Publication Date: 2011-02-08
- Inventor: Chun-Jung Chen , Jian-Chiun Liou , Yu-Hung Chuang
- Applicant: Chun-Jung Chen , Jian-Chiun Liou , Yu-Hung Chuang
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW95130365A 20060818
- Main IPC: H05K1/00
- IPC: H05K1/00
Abstract:
A flexible electronic assembly including a flexible circuit board and at least one electronic component is provided. The flexible circuit board includes at least one dielectric film layer and at least one patterned conductive layer disposed on the dielectric film layer. The electronic component is disposed on the flexible circuit board and electrically connected to the flexible circuit board. The flexible angle of the flexible electronic assembly is greater than 5 degrees.
Public/Granted literature
- US20080041617A1 FLEXIBLE ELECTRONIC ASSEMBLY Public/Granted day:2008-02-21
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