An audio jack adapted for receiving a mating audio plug includes an insulating housing and a contact. The insulating housing has an insertion hole for receiving the mating audio plug. A recess is formed at a front of a bottom surface of the insulating housing and communicated with the insertion hole. The contact is received in the recess and includes a base portion, a soldered portion and a resistance piece. The soldered portion bends and extends outward from a bottom edge of the base portion. The resistance piece includes an elastic arm extending forward from a front edge of the base portion, and an arc-shaped portion extending downwards from a distal end of the elastic arm and arched according to an outer periphery of the mating audio plug. A distal end of the arc-shaped portion defined as a contact portion.