Disclosed is a production process of an electronic circuit that can efficiently form a highly accurate electrically conductive pattern. The production process comprises the steps of: adhering insulating particles onto an electrically conductive base material to form an insulating pattern comprising a pattern region and a nonpattern region on the electrically conductive base material; adhering electrically conductive particles to the nonpattern region by first electrophoretic treatment; removing the pattern region by second electrophoretic treatment; and transferring the electrically conductive particles onto a recording medium to form an electrically conductive pattern of the electrically conductive particles onto the recording medium.