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US07888237B2 Method of cutting semiconductor wafer, semiconductor chip apparatus, and chamber to cut wafer 有权
切割半导体晶片，半导体芯片装置和切割晶片的腔室的方法

Method of cutting semiconductor wafer, semiconductor chip apparatus, and chamber to cut wafer
摘要：
A method of cutting a semiconductor wafer includes preparing a semiconductor wafer including a scribe region and a chip region, forming a groove in the scribe region, loading the semiconductor wafer with the groove formed therein in a chamber, and cutting the semiconductor wafer into a plurality of chips through increasing a pressure of the chamber by a first pressure change rate, and then reducing the pressure of the chamber by a second pressure change rate.
摘要（中）：

切割半导体晶片的方法包括制备包括划线区域和芯片区域的半导体晶片，在刻划区域形成沟槽，将其中形成有槽的半导体晶片装载在室中，并将半导体晶片切割成多个 通过增加室的压力达到第一压力变化率，然后将室的压力降低第二压力变化率。

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