- 专利标题: Integrated-circuit package for proximity communication
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申请号: US11864408申请日: 2007-09-28
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公开(公告)号: US07893531B2公开(公告)日: 2011-02-22
- 发明人: James G. Mitchell , John E. Cunningham , Ashok V. Krishnamoorthy
- 申请人: James G. Mitchell , John E. Cunningham , Ashok V. Krishnamoorthy
- 申请人地址: US CA Redwood Shores
- 专利权人: Oracle America, Inc.
- 当前专利权人: Oracle America, Inc.
- 当前专利权人地址: US CA Redwood Shores
- 代理机构: Park, Vaughan, Fleming & Dowler LLP
- 主分类号: H01L23/34
- IPC分类号: H01L23/34
摘要:
Embodiments of a multi-chip module (MCM) are described. This MCM includes a first semiconductor die and a second semiconductor die, where a given semiconductor die, which can be the first semiconductor die or the second semiconductor die, includes proximity connectors proximate to a surface of the given semiconductor die. Moreover, the given semiconductor die is configured to communicate signals with the other semiconductor die via proximity communication through one or more of the proximity connectors. Furthermore, the MCM includes an alignment plate and a top plate coupled to the alignment plate. This alignment plate includes a first negative feature configured to accommodate the first semiconductor die and a second negative feature configured to accommodate the second semiconductor die, and the top plate includes a positive feature. Note that the positive feature is coupled to the first semiconductor die, and the positive feature facilitates mechanical positioning of the first semiconductor die.
公开/授权文献
- US20090085183A1 INTEGRATED-CIRCUIT PACKAGE FOR PROXIMITY COMMUNICATION 公开/授权日:2009-04-02
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