发明授权
- 专利标题： Thermally insulating bonding pad structure for solder reflow connection
- 专利标题（中）： 用于焊料回流连接的热绝缘焊盘结构
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申请号： US11891530申请日： 2007-08-10
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公开(公告)号： US07893534B2公开(公告)日： 2011-02-22
- 发明人: Toshiki Hirano , Haruhide Takahashi , Tatsumi Tsuchiya
- 申请人： Toshiki Hirano , Haruhide Takahashi , Tatsumi Tsuchiya
- 申请人地址： NL Amsterdam
- 专利权人： Hitachi Global Storage Technologies, Netherlands, B.V.
- 当前专利权人： Hitachi Global Storage Technologies, Netherlands, B.V.
- 当前专利权人地址： NL Amsterdam
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A thermally insulating bonding pad for solder reflow is described. The bonding pad includes a structure. The structure forms the bonding pad. The bonding pad further includes an insulator formed on the structure. The insulator is configured to be interposed between the structure and a substrate of a component onto which said bonding pad is to be disposed. The bonding pad provides thermal insulation for said substrate when said bonding pad is subject to a solder reflow process being performed thereon.
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