A primary outer housing component for an electronic device formed via a cold-drawing process is disclosed. The electronic device can include internal operational components located within an outer housing, as well as a processor and one or more user interfaces in communication therewith. A primary outer housing component substantially surrounds and protects the internal operational components and processor, and comprises a single, continuous and seamless structural wall having a cross-sectional profile that includes an outer circumference and an inner circumference, as well as openings at a top end and bottom end thereof. Top and bottom end closures fit within and close off the top and bottom end openings in the primary outer housing component, which is formed using a cold-drawing material process that includes the use of a die to form the shape of the outer circumference and a mandrel to form the shape of said inner circumference.