Invention Grant
- Patent Title: Method for plating flexible printed circuit board
- Patent Title (中): 柔性印刷电路板电镀方法
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Application No.: US12109223Application Date: 2008-04-24
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Publication No.: US07897199B2Publication Date: 2011-03-01
- Inventor: Tso-Hung Yeh , Hung-Yi Chang , Chih-Kang Yang
- Applicant: Tso-Hung Yeh , Hung-Yi Chang , Chih-Kang Yang
- Applicant Address: TW Tayuan, Taoyuan
- Assignee: Foxconn Advanced Technology Inc.
- Current Assignee: Foxconn Advanced Technology Inc.
- Current Assignee Address: TW Tayuan, Taoyuan
- Agent Andrew C. Cheng
- Priority: CN200710075764 20070815
- Main IPC: H05K3/00
- IPC: H05K3/00
Abstract:
A method for plating a FPCB base board, comprising the steps of: providing a FPCB base board comprising a sprocket region; and placing an insulation shielding plate spatially opposite to the sprocket region of the FPCB base board to limit a thickness of a plating layer formed on the sprocket region of the FPCB base board.
Public/Granted literature
- US20090047421A1 METHOD FOR PLATING FLEXIBLE PRINTED CIRCUIT BOARD Public/Granted day:2009-02-19
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