发明授权
US07898076B2 Structure and methods of processing for solder thermal interface materials for chip cooling
有权
用于芯片冷却的焊料热界面材料的加工结构和方法
- 专利标题： Structure and methods of processing for solder thermal interface materials for chip cooling
- 专利标题（中）： 用于芯片冷却的焊料热界面材料的加工结构和方法
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申请号： US11742161申请日： 2007-04-30
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公开(公告)号： US07898076B2公开(公告)日： 2011-03-01
- 发明人: Bruce Furman , Madhusudan K. Iyengar , Paul A. Lauro , Yves Martin , Roger R. Schmidt , Da-Yuan Shih , Theodore G. Van Kessel , Wei Zou
- 申请人： Bruce Furman , Madhusudan K. Iyengar , Paul A. Lauro , Yves Martin , Roger R. Schmidt , Da-Yuan Shih , Theodore G. Van Kessel , Wei Zou
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Connolly Bove Lodge & Hutz LLP
- 代理商 Daniel P. Morris
- 主分类号： H01L23/10
- IPC分类号： H01L23/10
摘要：
Assemblies for dissipating heat from integrated circuits and circuit chips are disclosed. The assemblies include a low melt solder as a thermal interface material (TIM) for the transfer of heat from a chip to a heat sink (HS), wherein the low melt solder has a melting point below the maximum operating temperature of the chip. Methods for making the assemblies are also disclosed.
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