Invention Grant
- Patent Title: Bending apparatus, method thereof, and bending tool
- Patent Title (中): 弯曲装置及其弯曲工具
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Application No.: US10561960Application Date: 2004-06-22
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Publication No.: US07901341B2Publication Date: 2011-03-08
- Inventor: Masayuki Shimizu , Hidekatsu Ikeda , Takanori Okubo , Akio Kammuri , Hisashi Uto
- Applicant: Masayuki Shimizu , Hidekatsu Ikeda , Takanori Okubo , Akio Kammuri , Hisashi Uto
- Applicant Address: JP Kanagawa
- Assignee: Amada Company, Ltd
- Current Assignee: Amada Company, Ltd
- Current Assignee Address: JP Kanagawa
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2003-177586 20030623; JP2004-151082 20040520; JP2004-166512 20040604
- International Application: PCT/JP2004/009085 WO 20040622
- International Announcement: WO2004/112981 WO 20041229
- Main IPC: B23Q3/155
- IPC: B23Q3/155 ; B21D5/00

Abstract:
In a bending apparatus which moves one of upper and lower tables (9, 10), and performs bending on a workpiece (W) by tools (P, D) attached to the upper and lower tables (9, 10), a tool group including a plurality of split tools is transferred to the upper and lower table (9, 10), a plurality of process stations are formed by splitting the transferred tool into a plurality of tool groups based on automatically or manually determined tool-layout information, and then bending is carried out.
Public/Granted literature
- US20070271987A1 Bending Apparatus, Method Thereof, and Bending Tool Public/Granted day:2007-11-29
Information query
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