发明授权
- 专利标题: Group III nitride substrate, epitaxial layer-provided substrate, methods of manufacturing the same, and method of manufacturing semiconductor device
- 专利标题(中): III族氮化物衬底,提供外延层的衬底,其制造方法以及制造半导体器件的方法
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申请号: US12445681申请日: 2007-10-09
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公开(公告)号: US07901960B2公开(公告)日: 2011-03-08
- 发明人: Keiji Ishibashi , Akihiro Hachigo , Masato Irikura , Seiji Nakahata
- 申请人: Keiji Ishibashi , Akihiro Hachigo , Masato Irikura , Seiji Nakahata
- 申请人地址: JP Osaka
- 专利权人: Sumitomo Electric Industries, Ltd.
- 当前专利权人: Sumitomo Electric Industries, Ltd.
- 当前专利权人地址: JP Osaka
- 代理机构: Drinker Biddle & Reath LLP
- 优先权: JP2006-284488 20061019
- 国际申请: PCT/JP2007/069661 WO 20071009
- 国际公布: WO2008/047627 WO 20080424
- 主分类号: H01L21/00
- IPC分类号: H01L21/00
摘要:
A group III nitride substrate on which an epitaxially grown layer of good quality can be formed, and a method of manufacturing the same are obtained. A GaN substrate is one of the following: a group III nitride substrate, wherein the number of atoms of an acid material per square centimeter of a surface is not more than 2×1014, and the number of silicon atoms per square centimeter of the surface is not more than 3×1013; a group III nitride substrate, wherein the number of silicon atoms per square centimeter of a surface is not more than 3×1013, and a haze level of the surface is not more than 5 ppm; and a group III nitride substrate, wherein the number of atoms of an acid, material per square centimeter of a surface is not more than 2×1014, and a haze level of the surface is not more than 5 ppm.
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