发明授权
US07903831B2 Silicon based condenser microphone and packaging method for the same 失效
硅基电容麦克风和包装方法相同

  • 专利标题: Silicon based condenser microphone and packaging method for the same
  • 专利标题(中): 硅基电容麦克风和包装方法相同
  • 申请号: US11506664
    申请日: 2006-08-18
  • 公开(公告)号: US07903831B2
    公开(公告)日: 2011-03-08
  • 发明人: Chung Dam Song
  • 申请人: Chung Dam Song
  • 申请人地址: KR Namdong-gu, Incheon
  • 专利权人: BSE Co., Ltd.
  • 当前专利权人: BSE Co., Ltd.
  • 当前专利权人地址: KR Namdong-gu, Incheon
  • 代理机构: Ladas & Parry LLP
  • 优先权: KR10-2005-0076521 20050820; KR10-2005-0076522 20050820
  • 主分类号: H04R25/00
  • IPC分类号: H04R25/00
Silicon based condenser microphone and packaging method for the same
摘要:
Disclosed are a silicon based condenser microphone and a packaging method for the silicon based condenser microphone. The silicon based condenser microphone comprises a metal case, and a board which is mounted with a MEMS microphone chip and an ASIC chip having an electric voltage pump and a buffer IC and is formed with a connecting pattern for bonding with the metal case, wherein the connecting pattern is welded to the metal case. The method for packaging a silicon based condenser microphone includes the steps of inputting a board which is mounted with a MEMS chip and an ASIC chip and is formed with a connecting pattern; inputting a metal case, aligning the metal case on the connecting pattern of the board, and welding an opened end of the metal case to the connecting pattern of the board. Thus, the metal case is welded to the board by the laser.
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