Invention Grant
US07906739B2 Arrangement for surface mounting an electrical component by soldering, and electrical component for such an arrangement
有权
用于通过焊接表面安装电气部件的布置，以及用于这种布置的电气部件
- Patent Title: Arrangement for surface mounting an electrical component by soldering, and electrical component for such an arrangement
- Patent Title (中): 用于通过焊接表面安装电气部件的布置，以及用于这种布置的电气部件
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Application No.: US11948507Application Date: 2007-11-30
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Publication No.: US07906739B2Publication Date: 2011-03-15
- Inventor: Jean-Christophe Villain , Michel Cour
- Applicant: Jean-Christophe Villain , Michel Cour
- Applicant Address: US MA Newton
- Assignee: CoActive Technologies, LLC
- Current Assignee: CoActive Technologies, LLC
- Current Assignee Address: US MA Newton
- Agency: Pepper Hamilton LLP
- Priority: FR0655260 20061201
- Main IPC: H01H9/00
- IPC: H01H9/00
Abstract:
An arrangement may include a substrate and an electrical component. The electrical component may include a base made of an insulating material and a plurality of connection terminals. Each connection terminal is connected to a corresponding connection pad of the substrate by means of a spot of solder paste. The arrangement may further include a block interposed between the substrate and the base of the electrical component. The block may be located substantially on the axis of application of a force for actuating the electrical component and may be designed to inhibit deformation of the base. The block may include a spot of solder paste soldered to an associated conducting pad on the substrate.
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