发明授权
- 专利标题： Packaged device and method of manufacturing the same
- 专利标题（中）： 封装装置及其制造方法
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申请号： US12164670申请日： 2008-06-30
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公开(公告)号： US07906822B2公开(公告)日： 2011-03-15
- 发明人: Yoshihiro Mizuno , Norinao Kouma , Hisao Okuda , Hiromitsu Soneda , Tsuyoshi Matsumoto , Osamu Tsuboi
- 申请人： Yoshihiro Mizuno , Norinao Kouma , Hisao Okuda , Hiromitsu Soneda , Tsuyoshi Matsumoto , Osamu Tsuboi
- 申请人地址： JP Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JP Kawasaki
- 代理机构： Westerman, Hattori, Daniels & Adrian, LLP
- 优先权： JP2007-173077 20070629
- 主分类号： H01L29/84
- IPC分类号： H01L29/84
摘要：
A packaged device includes a package having an inner surface defining a closed internal space, a device chip fixed to the package in the internal space, and a parylene film covering at least a part of the inner surface of the package and/or at least a part of a surface of the device chip.
公开/授权文献
- US20090001487A1 PACKAGED DEVICE AND METHOD OF MANUFACTURING THE SAME 公开/授权日：2009-01-01