Invention Grant
- Patent Title: Laser processing method and laser processing apparatus
- Patent Title (中): 激光加工方法和激光加工设备
-
Application No.: US11902966Application Date: 2007-09-26
-
Publication No.: US07907341B2Publication Date: 2011-03-15
- Inventor: Motoki Kakui , Keiji Fuse
- Applicant: Motoki Kakui , Keiji Fuse
- Applicant Address: JP Osaka-shi
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi
- Agency: Venable LLP
- Agent Michael A. Sartori; Steven J. Schwarz
- Priority: JPP2006-264936 20060928
- Main IPC: G02B27/08
- IPC: G02B27/08 ; G02B27/10 ; H04B10/17

Abstract:
The present invention relates to a laser processing method and laser processing apparatus for enabling improvement and maintenance of homogenization of a beam intensity distribution in an irradiated region. The laser processing apparatus comprises, at least, an ASE light generation section for emitting ASE light, and a homogenizer for splitting the ASE light into multiple beams. The ASE generation section for emitting the ASE light as processing laser light is provided, and whereby the deterioration of homogenization due to inter-beam interference is suppressed. The homogenization of beam intensity distribution is improved by locating a condenser lens relative to an object such that the object is shifted from a focus position of the condenser lens in the homogenizer, by intentionally deteriorating a beam quality M2 of the ASE light itself emitted from the ASE light generation section to about 2 to 10, or by a combination of these, in laser processing.
Public/Granted literature
- US20080180788A1 Laser processing method and laser processing apparatus Public/Granted day:2008-07-31
Information query