Invention Grant
US07907385B2 Low inductance interconnect device for a power capacitor component
有权
用于功率电容器组件的低电感互连器件
- Patent Title: Low inductance interconnect device for a power capacitor component
- Patent Title (中): 用于功率电容器组件的低电感互连器件
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Application No.: US12172777Application Date: 2008-07-14
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Publication No.: US07907385B2Publication Date: 2011-03-15
- Inventor: Mark D. Korich , David Tang , Mark L. Selogie
- Applicant: Mark D. Korich , David Tang , Mark L. Selogie
- Applicant Address: US MI Detroit
- Assignee: GM Global Technology Operations LLC
- Current Assignee: GM Global Technology Operations LLC
- Current Assignee Address: US MI Detroit
- Agency: Ingrassia Fisher & Lorenz, P.C.
- Main IPC: H01G4/228
- IPC: H01G4/228

Abstract:
Systems and apparatus are provided for capacitor segments for use in a vehicle. A capacitor segment comprises an inner conductor configured to receive a first potential and having a generally L-shaped longitudinal cross-section. An outer conductor is configured to receive a second potential, and is electrically insulated from the inner conductor. The outer conductor comprises a first section having a generally L-shaped longitudinal cross-section aligned with the inner conductor, and a second section coupled to the first section and having a generally L-shaped lateral cross-section. The second section and the inner conductor define an inner region. A capacitor is located in the inner region and coupled to the inner conductor and the second section. The capacitor segment is configured such that current flows through the capacitor in a first direction, and current flows through the second section in a second direction that generally opposes the first direction.
Public/Granted literature
- US20100008018A1 LOW INDUCTANCE INTERCONNECT DEVICE FOR A POWER CAPACITOR COMPONENT Public/Granted day:2010-01-14
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