发明授权
- 专利标题: Resistance semiconductor memory device having three-dimensional stack and word line decoding method thereof
- 专利标题(中): 具有三维堆叠和字线解码方法的电阻半导体存储器件
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申请号: US12873836申请日: 2010-09-01
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公开(公告)号: US07907467B2公开(公告)日: 2011-03-15
- 发明人: Joon-Min Park , Sang-Beom Kang , Hyung-Rok Oh , Woo-Yeong Cho
- 申请人: Joon-Min Park , Sang-Beom Kang , Hyung-Rok Oh , Woo-Yeong Cho
- 申请人地址: KR Suwon-Si, Gyeonggi-Do
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-Si, Gyeonggi-Do
- 代理机构: F. Chau & Associates, LLC
- 优先权: KR10-2007-0007697 20070125
- 主分类号: G11C8/00
- IPC分类号: G11C8/00
摘要:
A resistance semiconductor memory device of a three-dimensional stack structure, and a word line decoding method thereof, are provided. In the resistance semiconductor memory device of a three-dimensional stack structure, in which a plurality of word line layers and a plurality of bit line layers are disposed alternately and perpendicularly, and in which a plurality of memory cell layers are disposed between the word line layers and the bit line layers; the resistance semiconductor memory device includes a plurality of bit lines disposed on each of the bit line layers in a first direction as a length direction; a plurality of sub word lines disposed on each of the word line layers in a second direction as a length direction, intersected to the first direction; a plurality of memory cells disposed on the memory cell layers; and a plurality of main word lines individually disposed on a main word line layer specifically adapted over the bit line layers and the word line layers, in the second direction as a length direction, each one of the plurality of main word lines being shared by a predetermined number of sub word lines. An efficient word line decoding adequate to high integration can be achieved.
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