The clearance ‘d’ between a substrate 3 and a mask 2 can be reduced at the time of the position recognition by horizontally offsetting two recognition devices 53,54 for recognizing the substrate 3 and the mask 2. Therefore, since the ascending stroke of the substrate 3 can be shortened at the time of the position alignment to contact the rear face of the substrate 3 with the rear face of the mask 2, the position misalignment of the substrate in the horizontal direction caused by the raising is suppressed. Accordingly, it is possible to suppress the reduction of the position alignment accuracy with the mask 2.