发明授权
- 专利标题： Semiconductor device having adhesion increasing film to prevent peeling
- 专利标题（中）： 具有增粘膜以防止剥离的半导体装置
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申请号： US11761796申请日： 2007-06-12
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公开(公告)号： US07910405B2公开(公告)日： 2011-03-22
- 发明人: Osamu Okada , Hiroyasu Jobetto
- 申请人： Osamu Okada , Hiroyasu Jobetto
- 申请人地址： JP Tokyo JP Tokyo
- 专利权人： Casio Computer Co., Ltd.,CMK Corporation
- 当前专利权人： Casio Computer Co., Ltd.,CMK Corporation
- 当前专利权人地址： JP Tokyo JP Tokyo
- 代理机构： Holtz, Holtz, Goodman & Chick, PC
- 优先权： JP2004-164363 20040602
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A semiconductor device includes at least one semiconductor constructing body provided on one side of a base member, and having a semiconductor substrate and a plurality of external connecting electrodes provided on the semiconductor substrate. An insulating layer is provided on the one side of the base member around the semiconductor constructing body. An adhesion increasing film is formed between the insulating layer, and at least one of the semiconductor constructing body and the base member around the semiconductor constructing body, for preventing peeling between the insulating layer and the at least one of the semiconductor constructing body and base member.