发明授权
- 专利标题： Multilayered printed circuit board, solder resist composition, and semiconductor device
- 专利标题（中）： 多层印刷电路板，阻焊剂组合物和半导体器件
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申请号： US11838365申请日： 2007-08-14
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公开(公告)号： US07910836B2公开(公告)日： 2011-03-22
- 发明人: Hui Zhong , Kenichi Shimada , Yukihiko Toyoda , Motoo Asai , Dongdong Wang , Koji Sekine , Yoshitaka Ono
- 申请人： Hui Zhong , Kenichi Shimada , Yukihiko Toyoda , Motoo Asai , Dongdong Wang , Koji Sekine , Yoshitaka Ono
- 申请人地址： JP Ogaki-shi
- 专利权人： Ibiden Co. Ltd.
- 当前专利权人： Ibiden Co. Ltd.
- 当前专利权人地址： JP Ogaki-shi
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JP11-228852 19990812; JP11-230875 19990817; JP11-266932 19990921; JP11-269320 19990922; JP2000-102769 20000404
- 主分类号： H05K1/03
- IPC分类号： H05K1/03
摘要：
The present invention is to provide a multilayered printed circuit board free from cracks attributed to thermal expansion difference between a solder resist layer and another part and a multilayered printed circuit board of the present invention comprises a conductor circuit and a resin insulating layer serially formed on a substrate in an alternate fashion and in repetition and a solder resist layer formed as an outermost layer, and the solder resist layer contains an inorganic filler.
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