Invention Grant
- Patent Title: System and a method for forming a heat fusible microporous ink receptive coating
- Patent Title (中): 系统和形成热熔微孔油墨接受涂层的方法
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Application No.: US10789963Application Date: 2004-02-27
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Publication No.: US07914864B2Publication Date: 2011-03-29
- Inventor: Radha Sen , Tienteh Chen , Robert Beer , Kristina Gee
- Applicant: Radha Sen , Tienteh Chen , Robert Beer , Kristina Gee
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: B41M5/52
- IPC: B41M5/52 ; B41M5/36 ; G03G5/10 ; C08F290/10
Abstract:
A system for forming a microporous ink receptive coating includes a fusible latex configured to coat a substrate, wherein the fusible latex includes a hard core material and a soft shell material, wherein the latex exhibits self-adhesive properties at a system operation temperature.
Public/Granted literature
- US20050191445A1 System and a method for forming a heat fusible microporous ink receptive coating Public/Granted day:2005-09-01
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