发明授权
- 专利标题： Semiconductor die package including IC driver and bridge
- 专利标题（中）： 半导体管芯封装，包括IC驱动器和桥
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申请号： US12046734申请日： 2008-03-12
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公开(公告)号： US07915721B2公开(公告)日： 2011-03-29
- 发明人: Yong Liu , Jiangyuan Zhang , Qiuxiao Qian
- 申请人： Yong Liu , Jiangyuan Zhang , Qiuxiao Qian
- 申请人地址： US ME South Portland
- 专利权人： Fairchild Semiconductor Corporation
- 当前专利权人： Fairchild Semiconductor Corporation
- 当前专利权人地址： US ME South Portland
- 代理机构： Kilpatrick Townsend & Stockton LLP
- 主分类号： H01L23/02
- IPC分类号： H01L23/02
摘要：
A semiconductor die package. Embodiments of the semiconductor die package are usable in backlight circuitry. Systems in packages may include a bridge circuit or a part thereof, and a integrated circuit die, such as a driver die, encapsulated by a molding material or other package. The bridge circuit may be stacked on opposing surfaces of a leadframe.
公开/授权文献
- US20090230518A1 SEMICONDUCTOR DIE PACKAGE INCLUDING IC DRIVER AND BRIDGE 公开/授权日：2009-09-17
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