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US07916295B2 Alignment mark and method of getting position reference for wafer 有权
对准标记和获取晶片位置参考的方法

Alignment mark and method of getting position reference for wafer
摘要：
An alignment mark on a wafer is described, including at least one dense pattern and at least one block-like pattern adjacent thereto and shown as at least one dark image and at least one bright image adjacent thereto. A method of getting a position reference for a wafer is also described. An above alignment mark is formed. The alignment mark, which is shown as at least one dark image and at least one bright image adjacent thereto that are formed by the at least one dense pattern and the at least one block-like pattern, is then detected.
摘要（中）：

描述晶片上的对准标记，其包括至少一个致密图案和与其相邻的至少一个块状图案，并且示出为至少一个暗图像和与其相邻的至少一个亮像。 还描述了获得晶片的位置参考的方法。 形成上述对准标记。 然后检测作为至少一个暗图像和与其相邻的至少一个亮图像的对准标记，其由至少一个密集图案和至少一个块状图案形成。

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