发明授权
- 专利标题: In-ear headphones
- 专利标题(中): 入耳式耳机
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申请号: US11428057申请日: 2006-06-30
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公开(公告)号: US07916888B2公开(公告)日: 2011-03-29
- 发明人: Roman Sapiejewski , William W. Tice , Jason M. Harlow , Ian M. Collier , Kevin P. Annunziato , Pericles Nicholas Bakalos , Michael J. Monahan
- 申请人: Roman Sapiejewski , William W. Tice , Jason M. Harlow , Ian M. Collier , Kevin P. Annunziato , Pericles Nicholas Bakalos , Michael J. Monahan
- 申请人地址: US MA Framingham
- 专利权人: Bose Corporation
- 当前专利权人: Bose Corporation
- 当前专利权人地址: US MA Framingham
- 主分类号: H04R25/00
- IPC分类号: H04R25/00
摘要:
An earphone includes a first acoustic chamber including a reactive element and a resistive element in parallel, a second acoustic chamber separated from the first acoustic chamber by an acoustic transducer, and a housing to support the apparatus from the concha of a wearer's ear and to extend the second acoustic chamber into the ear canal of the wearer's ear.A cushion includes a first material and a second material and is formed into a first region and a second region. The first region defines an exterior surface shaped to fit the concha of a human ear. The second region defines an exterior surface shaped to fit the ear canal of a human ear. The first and second regions together define an interior surface shaped to accommodate an earphone. The first material occupies a volume adjacent to the interior surface. The second material occupies a volume between the first material and the first and second outer surfaces. The first and second materials are of different hardnesses.
公开/授权文献
- US20080002835A1 Earphones 公开/授权日:2008-01-03
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