发明授权
- 专利标题： Bonding structure of circuit substrate and instant circuit inspection method thereof
- 专利标题（中）： 电路基板的接合结构及其即时电路检测方法
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申请号： US11905439申请日： 2007-10-01
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公开(公告)号： US07919782B2公开(公告)日： 2011-04-05
- 发明人: Ming-Tan Hsu , I-Cheng Shih
- 申请人： Ming-Tan Hsu , I-Cheng Shih
- 申请人地址： TW Padeh, Taoyuan
- 专利权人： Chunghwa Picture Tubes, Ltd.
- 当前专利权人： Chunghwa Picture Tubes, Ltd.
- 当前专利权人地址： TW Padeh, Taoyuan
- 代理商 Winston Hsu; Scott Margo
- 优先权： TW95148472A 20061222
- 主分类号： H01L29/20
- IPC分类号： H01L29/20
摘要：
The present invention provides a bonding structure of circuit substrates and an instant circuit inspection method thereof. The contact pad design of the bonding structure has an instant inspection ability of circuit connection in bonding two circuit substrates. In two bonded circuit substrates, the signal inputted at the circuit part passes the conductive particles to the first contact pad, and then passes the conductive particles again to the detecting part from the first contact pad. Therefore, measuring the output signal can inspect the reliability of the circuit connection of the bonded circuit substrates. If the output signal is the same as the input signal, the bonding structure between the first contact pad and the circuit part is validated, or, if not, the bonding structure is invalidated.
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