Invention Grant
- Patent Title: Method of applying wire voltage to semiconductor device
- Patent Title (中): 将线电压施加到半导体器件的方法
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Application No.: US12580299Application Date: 2009-10-16
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Publication No.: US07920021B2Publication Date: 2011-04-05
- Inventor: Jin-Yong Oh , Sang-youn Jo , Joon-hee Lee , Jae-sun Yun , Seong-soo Kim
- Applicant: Jin-Yong Oh , Sang-youn Jo , Joon-hee Lee , Jae-sun Yun , Seong-soo Kim
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Volentine & Whitt, PLLC
- Priority: KR10-2009-0012116 20090213
- Main IPC: H01L25/00
- IPC: H01L25/00

Abstract:
A method of applying a wire voltage to a semiconductor device including a plurality of active regions and a field region insulating the plurality of active regions, wherein the field region includes a plurality of wires. The method includes applying an operating voltage required for an operation of the semiconductor device to at least one of the plurality of wires, and applying a voltage lower than the operating voltage to a wire adjacent to at least one of the plurality of active regions from among the plurality of wires. Thus, leakage current caused by an imaginary parasitic transistor due to a wire of the field region may be prevented.
Public/Granted literature
- US20100207690A1 METHOD OF APPLYING WIRE VOLTAGE TO SEMICONDUCTOR DEVICE Public/Granted day:2010-08-19
Information query
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