Invention Grant
- Patent Title: Thermal conductivity measuring method and apparatus, and gas component ratio measuring apparatus
- Patent Title (中): 热导率测量方法和装置以及气体组分比测量装置
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Application No.: US12088225Application Date: 2006-09-25
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Publication No.: US07926323B2Publication Date: 2011-04-19
- Inventor: Yasuharu Ooishi , Shigeru Aoshima , Nobuyoshi Shingyouji , Yasue Hayashi , Shuji Morio
- Applicant: Yasuharu Ooishi , Shigeru Aoshima , Nobuyoshi Shingyouji , Yasue Hayashi , Shuji Morio
- Applicant Address: JP Tokyo
- Assignee: Yamatake Corporation
- Current Assignee: Yamatake Corporation
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz, Goodman & Chick, PC
- Priority: WOPCT/JP2005/017748 20050927
- International Application: PCT/JP2006/318987 WO 20060925
- International Announcement: WO2007/037209 WO 20070405
- Main IPC: G01N25/18
- IPC: G01N25/18
Abstract:
A heat radiation coefficient C [=Ph/(Th−To)] from a microheater is calculated in accordance with a power Ph applied to the microheater which is supported in air and provided in an ambient gas, a heater temperature Th, and an ambient temperature To at this moment. Further, a thermal conductivity λ(T) of the ambient gas is obtained from the calculated heat radiation coefficient C based on a proportional relation [C=K·λ(T)] between a thermal conductivity λ(T) of the ambient gas and the heat radiation coefficient C at a measurement temperature T [=(Th−To)/2].
Public/Granted literature
- US20090277246A1 THERMAL CONDUCTIVITY MEASURING METHOD AND APPARATUS, AND GAS COMPONENT RATIO MEASURING APPARATUS Public/Granted day:2009-11-12
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