Invention Grant
- Patent Title: Method of manufacturing an adhesive mount for a leveling device
- Patent Title (中): 制造用于整平装置的粘合剂支架的方法
-
Application No.: US12379472Application Date: 2009-02-23
-
Publication No.: US07927450B2Publication Date: 2011-04-19
- Inventor: James Spaulding , John C. Murray
- Applicant: James Spaulding , John C. Murray
- Applicant Address: US CT New Britain
- Assignee: Stanley Black Decker, Inc.
- Current Assignee: Stanley Black Decker, Inc.
- Current Assignee Address: US CT New Britain
- Agency: Pillsbury Winthrop Shaw Pittman LLP
- Main IPC: B29C65/48
- IPC: B29C65/48 ; B29C65/52 ; B32B37/04 ; B32B37/12 ; B32B37/26 ; B32B7/14 ; B05D5/10
Abstract:
A method of manufacturing a mount includes dispensing a predetermined amount of molten thermoplastic adhesive on a release liner, attaching a tab to the adhesive while the adhesive is at a temperature above its softening point, and cooling the adhesive to a temperature below its softening point.
Public/Granted literature
- US20090159202A1 Method of manufacturing an adhesive mount for a leveling device Public/Granted day:2009-06-25
Information query
