发明授权
- 专利标题: Coating solution for forming high dielectric constant thin film and method for forming dielectric thin film using the same
- 专利标题(中): 用于形成高介电常数薄膜的涂布溶液及使用其形成介电薄膜的方法
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申请号: US12437657申请日: 2009-05-08
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公开(公告)号: US07927517B2公开(公告)日: 2011-04-19
- 发明人: Jun Hee Bae , Seung Hyun Kim , Yul Kyo Chung , Won Hoon Song , Sung Taek Lim , Hyun Ju Jin
- 申请人: Jun Hee Bae , Seung Hyun Kim , Yul Kyo Chung , Won Hoon Song , Sung Taek Lim , Hyun Ju Jin
- 申请人地址: KR Kyungki-do
- 专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址: KR Kyungki-do
- 代理机构: McDermott Will & Emery LLP
- 优先权: KR10-2005-0093143 20051004
- 主分类号: C09D5/24
- IPC分类号: C09D5/24 ; H01B1/08
摘要:
Disclosed herein are a coating solution for the formation of a dielectric thin film and a method for the formation of a dielectric thin film using the coating solution. The coating solution comprises a titanium alkoxide, a β-diketone or its derivative, and a benzoic acid derivative having an electron donating group. The method comprises spin coating the coating solution on a substrate to form a thin film and drying the thin film at a low temperature to crystallize the thin film. The titanium-containing coating solution is highly stable. In addition, the coating solution enables formation of a thin film, regardless of the kind of substrates, and can be used to form dielectric thin films in an in-line mode in the production processes of PCBs.
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