Photoresist composition and method of manufacturing array substrate using the same

Invention Grant

US07927897B2 Photoresist composition and method of manufacturing array substrate using the same 有权

Title translation: 光刻胶组合物及其制造方法

Patent Title: Photoresist composition and method of manufacturing array substrate using the same
Patent Title (中): 光刻胶组合物及其制造方法
Application No.: US12327215

Application Date: 2008-12-03
Publication No.: US07927897B2

Publication Date: 2011-04-19
Inventor: Hi-Kuk Lee , Sang-Hyun Yun , Min-Soo Lee , Deok-Man Kang , Sae-Tae Oh , Jae-Young Choi
Applicant: Hi-Kuk Lee , Sang-Hyun Yun , Min-Soo Lee , Deok-Man Kang , Sae-Tae Oh , Jae-Young Choi
Applicant Address: KR Suwon-si JP Tokyo
Assignee: Samsung Electronics Co., Ltd.,AZ Electronic Materials (Japan) K.K.
Current Assignee: Samsung Electronics Co., Ltd.,AZ Electronic Materials (Japan) K.K.
Current Assignee Address: KR Suwon-si JP Tokyo
Agency: H.C. Park & Associates, PLC
Priority: KR10-2008-0017354 20080226
Main IPC: H01L21/00
IPC: H01L21/00

Abstract:

A photoresist composition includes a binder resin, a photo acid generator, an acryl resin having four different types of monomers, and a solvent.

Abstract(Chinese):

光致抗蚀剂组合物包括粘合剂树脂，光酸产生剂，具有四种不同类型的单体的丙烯酸树脂和溶剂。

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IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备